SAMSUNG considerably improvises heat dissipation in LCD TVs with its maiden DDI Package - Instablogs
SAMSUNG considerably improvises heat dissipation in LCD TVs with its maiden DDI Package
Er. , Shimla: Feb 6 2007
Made Popular Feb 6 2007
Samsung Electronics Co., Ltd., one of the leaders in advanced semiconductor technology, proudly announced that it has innovated the industry’s first thermally-enhanced and heat capable chip-on-film called the TECOF package for the display...
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